Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.

Facilities & Equipments

• ETS-364

  Up to 240 Analog Channels

  Up to 128 Digital Channels

  Data Rate 66 Mhz

  DPU-16 / APU-12 / SPU-100 / SPU-500 / QMS

  

• SX-5000

  V/I 592pin(Dig 256pin + APU 336pin)

  128 Test Site

  100MHz Vector Rate

  128MW Vector Memory

  Mixed Signal, PMIC Test System

  

• Verigy 93000

  +80V/-40V

  20mA per Channel

  Max 4A(Pulse Mode)

  800Mbps Data Rate

  768ch(Upgradable to 2048ch)

  Mixed Signal, SoC Test System

  

• Opus3

  8~12inch Wafer

  0.5sec Index Time

  ±175mm X Probing Area

  ±165mm Y Probing Area

  ±1um XY Probing Accuracy

  300kg probing force

  

• J750(EX)/ IP750(EX)

  Max 2048 Pins

  80 Test site

  800 Mbps Data Rate

  High (120 ~ 160℃)

  Low (-25 ~ -45℃)

  Automotive

  Mixed Signal, MCU, CCD/CIS

  

• P-8XLm

  Wafer Size: 100,125,150,200 mm

  Stage Technology: Ball screw

  XY probing Accuracy: ±2.0 ㎛

  Z probing Accuracy: ±5.0 ㎛

  Probing Force: 60 kg

  Optical System

  Operation System

  

• SX-3030

  V/I 256Pin(Dig 128pin + APU 128pin)

  32 Test Site

  50MHz Vector Rate

  8MW Vector Memory

  Mixed Signal, PMIC Test System

  

Customer