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Analysis Prober

EG 4090 Series Spec Sheet (Typical)
WAFER SIZE CAPACITY
Authentic Wafer Sizing for 100mm, 125mm, 150mm, 200mm (4″, 5″, 6″, 8″)

WAFER HANDLING
1 cassette of 25 or 26 slots
Sequential
Programmable access controllable via external I/O
Auxillary wafer tray
Quick single wafer insertion and extraction
Cross slot wafer detection
Quickloader station
Intelligent Quickload pipelining

ACCURACY
± 4µm (system accuracy includes X, Y, Ø and Z)**
**definition available upon request

XY POSITIONING
Travel – 19.80″ (503mm) X, 9.42″ (239mm) Y
Maximum Speed – 10.0 in/sec (254.0 mm/sec)
Maximum Acceleration – 1.1G X axis, 0.53G Y axis
Resolution – 0.01 mils (0.25µm)
Repeatability – 0.01 mils (0.25µm)



Z-STAGE
Resolution Z 0.25 mil 0.125mil
Load 25lbs (11.3kgs) 40lbs (18.0 kgs)
Speed 390 µsec/step 390 µsec/step
Probing Range 230 mil (5.8mm) 230 mil (5.8mm)
Travel-Full 400 mil (10.2mm) 400 mil (10.2mm)
Repeatability Z 0.25 mil (6.4µm) 0.125 mil (3.2µm)
ø Travel ±5º ±5º
o Resolution 0.000917º/step 0.000917º/step
CHUCK TOPS
Standard – ambient probing
Hot – ambient to 130ºC
Specials – other ranges (hot and cold) available
Available in Au, Ni, AI (unplated)

AUTOMATION
PTPA* – Probe to Pad Alignment, Aluminized wafer, DPS II (Direct Probe Sensor II), APPV (Automatic Probe Position Verification)
PTPO* – Probe to Pad Optimization
OCR* – Optical Character Recognition
PMI* – Probe Mark Inspection
IDI* – Ink Dot Inspection
STAA – Self Teach Auto Align
WSSC – Wafer Stepping and Scaling Calibration
APCC* – Automatic Probe Cleaning and Continuity Pad

SYSTEM ARCHITECTURE
Multiple processors based around a Pentium™ core
Flash memory (core program)
PCI bus internal PCBs (Serial and Video)
PCI bus Ethernet PCB providing 10 and 100 MHz I/O speeds *

INTERFACE CAPABILITIES
Tester Interface Packages
All major ATE manufacturers
Motorized Probe Card Theta or Semi-Automatic Probe Card Changer are available on a variety of tester application packages
GEM – Generic Equipment Model*
SEMI standard communications for factory automation and control
AUI – Advanced User Interface
FPD – Flat Panel Display, 10.4″ Active Matrix Display
Touch Screen – Standard Feature
Elastomer Keyboard* – Cleanroom compatible AT style

NETWORKING AND TESTER COMMUNICATIONS
Standard Interfaces: RS232C, TTL (Parallel I/O), GPIB (IEEE-488)
Standard Protocols: EG Enhanced, RDP
Interface Protocols*: Ethernet (10/100 Mbps), GEM/HSMS compliant

SOFTWARE
EGCommander
A modular, object oriented software system designed for a balance of test environment flexibility and operational ease of use

Design Feature Benefits:
User Configurable Operator Screens
Permits the user to set up simple operating screens for production use while maintaining the power and flexibility of EGCommander
Recipe Structured
Probing process customization and optimization
Graphic Control Map Editor
Designed probing modes to maximize productivity
Checklists
Ensures repeatable probing process
EG Prober Vision Compatible
Transfer most current Electroglas 2000/3000 test programs

DIMENSIONS
Footprint – 45.3″ (115 cm)W x 35.2″ (89.4cm) D x 34.2″ (88cm) H
Weight – 1027 lbs (462 kgs)

FACILITY REQUIREMENTS
Electrical VOLTS AMPS Hz
100 16.5 50/60
115 15 50/60
230 7.5 50/60
Air: minimum 85 psi CDA, 3.0 SCFM
Vacuum: 22 in Hg minimum